|
| TECHNOLOGY / CAPABILITIES |
| |
 |
Technology |
|
Capabilities |
|
|
| • |
Unclad, Single, Double and Multilayer (up to 16 Layers) |
| • |
Materials |
| |
|
FR4, FR406, FR408, PTFE (Teflon), BT, Cyanate Ester, Polyimide,
Multifunctional Epoxy, Ceramic Filled, GETEK®, Low Dk, Low Df,
High Tg and Metal Backed |
| • |
Mixed Dielectric Multilayer Constructions |
| • |
Blind/Buried Vias |
| • |
Controlled Impedance/Dielectrics |
| • |
RoHS Compliant Process Finishes |
| |
|
Lead-free HAL, Immersion Silver, Electrolytic Soft/Hard Gold,
Electroless Nickel/Immersion Gold (ENIG), Immersion Tin and OSP |
| • |
Sequential Lamination |
| • |
Silver/Ceramic/LPI Soldermask Filled Vias |
| • |
Heavy Copper Inner and Outer Layers (up to 10 oz) |
| • |
Castellation Holes (“half-moon” PTHs) |
| • |
Controlled Depth Drilling |
| • |
Heat Sink Fab/Bonding |
| • |
Edge/Cavity Plating |
| • |
Carbon Ink/Peelable Soldermask |
| |
|
|
|
You are here : Home 
Technology
