| • 1985 – Began operations in an 8,000 sq. ft. facility |
| • 1988 – Offered first RF, Microwave product |
| • 1990 – Expanded product offerings to include Multilayer PCBs |
| • 1991 – Facility expansion to 14,000 sq. ft. |
| • 1992 – Started RF, Microwave, and Advanced Technologies Division. |
| • 1994 – Facility expansion to 23,000 sq. ft. |
| • 1996 – Introduced Blind/Buried Via Technology |
| • 1997 – Facility expansion to 35,000 sq. ft. |
| • 2000 – Added environmentally friendly Plasma etch back process system |
| • 2001 – ISO 9002/1994 Certification |
| • 2003 – ISO 9001/2000 Certification |
| • 2004 – Added environmentally friendly automatic electroplating PAL system |
| • 2007 – Set Company Sales Record |
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Milestones
