| MATERIALS |
| Min finished thickness D/S |
.005” |
| Min finished thickness M/L |
.014” |
| Max finished thickness |
.250” |
| Max PCB size |
24.0” X 96.0” |
| Min I/L core thickness |
.004” |
| Min dielectric thickness |
.004” |
| Finished thickness tolerance |
+/- 10% |
| Copper weights available (base/foil) |
1/2,1, 2, 3, 4 oz |
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|
| DRILLING |
| Min finished hole size |
.006” |
| Min drilled size |
.010” |
| Max drilled size |
.200” |
| Max drilling aspect ratio |
12:1 |
| Hole location tolerance |
+/- .003” |
| PTH diameter tolerance |
+/- .003” |
| NPTH diameter tolerance |
+/- .002” |
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|
| IMAGING |
| Min line/space (1/2-1 oz base Cu) |
.003”/.003” |
| Min line/space (2 oz base Cu) |
.008”/.008” |
| Min line/space (3+ oz base Cu) |
.012”/.012” |
| Min SMT pitch |
.012” |
| Min I/L clearance to finished hole size |
.020” |
| Min O/L pad to finished hole size |
.014” |
| Registration tolerance (top to bottom) |
+/- .002” |
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|
| PROCESS FINISHES/PLATING |
| HASL or Lead-free HAL |
.0003” min thickness |
| Electroless Ni/Immersion Au (ENIG) |
3-6 µ” |
| Immersion Silver |
8-15 µ” |
| Electrolytic soft/hard Ni/Au |
Spec thickness requirement |
| Immersion white tin |
15-30 µ” |
| Organic Soldering Preservative (OSP) |
Co-planarity with Cu surface |
| Max plating aspect ratio |
10:1 |
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|
| ETCHING |
| ½ oz Copper (base/foil) |
+/- .0005” |
| 1 oz Copper (base/foil) |
+/- .001” |
| 2 oz Copper (base/foil) |
+/- .002” |
| 3 oz Copper (base/foil) |
+/- .003” |
| 4 oz Copper (base/foil) |
+/- .004” |
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|
| LPI Soldermask/Legend |
| Soldermask registration tolerance |
+/- .0025” |
| Min soldermask clearance |
.003”/Pad or SMT Feature |
| Soldermask conductor overlap |
.003” over conductor edge |
| Min soldermask dam/web thickness |
.004” |
| Min legend aperture |
.008” |
| Min legend font height |
.007” |
| Min distance from pad or SMT feature |
.006” |
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|
| FABRICATION |
| Rout edge to edge tolerance |
+/- .005 |
| Rout hole/feature to edge tolerance |
+/- .005 |
| Rout min inside radius |
.015” |
| Score line to score line tolerance |
+/- .010” |
| Score line to hole/feature tolerance |
+/- .010” |
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|
| ELECTRICAL TEST |
| Min SMT pitch |
.012” |
| Min continuity |
10 Ohm |
| Min isolation |
10 M Ohm |
| Voltage range available |
10-200 VDC |
| Controlled impedance tolerance |
+/- 10% |
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